Subject: | |
From: | |
Reply To: | |
Date: | Thu, 22 Dec 2005 15:09:14 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
George of course is correct!
You can also calculate the thickness of the intermetallic layer. The equation and constants are in a paper I presented at SMTA on HASL (back when it was all the rage) in 1990.
Best regards
Lee
J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389
----- Original Message -----
From: George Milad<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Thursday, December 22, 2005 11:17 AM
Subject: Re: [TN] Intermetalic Layer
The copper tin intermetallic layer thickness will depend on reflow
temperature and time at temperature.
Note: the IMC will grow over time and will not stay fixed.
We have data that was presented in the Lead free IPC/JEDEC conference showing
the increase in IMC thickness when the joint is subjected to accelerated age
testing, ( 150 deg C for up to 1000hours).
Best regards
George Milad
National Accounts Manager for tTchnology
Uyemura International Corporation
240 Town Line Rd
Southigton, CT06489
860 793 4011 (O)
516 901 3874 (cell)
[log in to unmask]<mailto:[log in to unmask]>
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives<http://listserv.ipc.org/archives>
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16<http://www.ipc.org/contentpage.asp?Pageid=4.3.16> for additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|