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| From [log in to unmask] Tue Jun 18 14: |
09:49 1996 |
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A customer of ours is asking what is the best practice baking
procedure (or pre-conditioning) of loaded board prior to IR reflow or
wave soldering.
All of our specs in house deal with bare boards. I know there must be
an IPC assy spec that specifies boards pre-conditioning at reflow. Can
someone tell me the spec#, temperature and duration?
Thanks.
Teik M. Ng
[log in to unmask]
PC World
Toronto, Canada
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