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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 6 Apr 2000 13:06:24 -0700 |
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Just for clarification, IPC-MF-150 has been re-named or will be called IPC-4562 (Metal Foil for Printed Wiring Applications) in the future, in case you can't find it.
Hans
-----Original Message-----
From: Timothy Reeves [SMTP:[log in to unmask]]
Sent: Thursday, April 06, 2000 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Gold Roughness
Stephen,
The only spec that I am aware of giving plating roughness requirements is
for the copper foil itself, not for anything plated on it. It is the
IPC-MF-150. Of course, if the gold is only 20 microinches thick, any
roughness greater than that is due to the underlying metal-- possibly the
nickel, and probably the copper. And that is a pretty negligible
roughness...20 microinch = approx. 0.5 microns. The spec. for very low
profile (the best) is 5.1 micron max. roughness.
Tim Reeves
> ----------
> From: Stephen Ayotte
> Sent: Thursday, April 6, 2000 5:41
> Subject: Gold Roughness
>
> For printed circuit boards is there and IPC specification for the allowed
> roughness of the plated gold on top of a copper feature. If so what spec
> is that in?
>
> thx.
>
> Stephen Ayotte, MD Manufacturing Quality Engineer
> Bldg. 966-2, Office 2J1309, Dept. N62V
> Essex Junction, Vt 05452
> Phone: External - 802-769-4775, tieline - 8-446-4775
> Pager: External - 802-878-5386 Pin # 4685, Internal - 74685
>
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