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Date: | Fri, 15 Feb 2019 19:32:06 +0000 |
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FOD on the lamination separation plates. If they are using CAC it is likely from the steel separator near the first/last panel in the stack. Multi-up panels will give you more than 1 occurrence and with the 2 you have you might see the depression lines up.
Jeffrey Bush
Program Quality Engineering Manager
Electronic Systems Division
C4ISR Solutions – Space Systems Group
P.O. Box 868
Nashua, NH 03061-0868
T: (603) 885-8137 | M: (603) 318.8056 | E: [log in to unmask]
144 DW Highway, Merrimack, NH 03054 Mail Stop: MER24-116A-A4
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Tom Brendlinger
Sent: Wednesday, February 6, 2019 3:36 PM
To: [log in to unmask]
Subject: [TN] "Wrinkle" on outer copper layer
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EXTERNAL EMAIL -- This message originates from outside our organization.
Hello TechNet,
I've recently received some boards that have a defect I've never seen before.
There is a linear depression in a 2oz outer copper layer on two out of 45 boards. One of the boards was on a solder sample panel, the other was assembled with the defect.
The depression has the appearance of a wrinkle or groove, it is approximately straight and square to the edge of the board. At its widest point it is about 0.006" wide, and as far as we can measure it is between 0.0015" and 0.002" deep. There are a couple of small delaminations nearby (on a panel that has not been reflowed).
I looked through IPC-A-600 and did not find anything about this type of issue. I don't have the equipment to microsection or x-ray the board, so I'm not sure whether the foil is damaged under the plating (Which is RoHS ENIG).
Hopefully this image link works:
https://snag.gy/Kx58Oy.jpg
Please let me know if you've seen this before or otherwise know how I can find more information.
Thank you!
Tom Brendlinger
Senior Electrical Engineer
Superpedestrian, Inc.
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