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26 Nov 96 11:07:48 PST |
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| From [log in to unmask] Tue Dec 3 13: |
53:18 1996 |
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<6FA0E639028DD9D1@-SMF-> |
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We are reviewing our SMT pad patterns and would like to evaluate them
based on the volume of solder AFTER reflow. I understand a rule-of thumb
for volume after reflow relative to volume before reflow is approximately
50%. However, I feel like I need more precise information.
Can someone tell me what the relationships are, or where to find a
reference, for volume after reflow based on per cent metal content
(88-92%) of the paste and particle size distribution (Type II or III)?
Thanks in advance
Regards
Sherman Banks
[log in to unmask]
408/481-6047
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