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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 7 Mar 2000 15:31:01 +0800 |
Content-Type: | text/plain |
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Hi,
I am currently working with Atotech horizontal Copper pulse plating proccess
with inert anode.
Anybody have the experience with this process with leveller I, II , III or H6
especially regarding
bath stability? Any reliability and throwing power data available ?
What is the forward, average and reverse current density used ?
What is the frequency of carbon treatment ?
What is the operating range of brightener and leveller ?
What is the operating speed and the plating thickness achieved ?
What process preceeds the pulse plating process (e.g. E'less Cu, DM or
others) ?
Thank you and with best regards
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