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September 1999

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Sender:
TechNet <[log in to unmask]>
Date:
Tue, 28 Sep 1999 11:59:19 -0600
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Ian Slater <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
Pad Sizing
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1.0
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7BIT
Organization:
GE HARRIS Energy Control Systems
From:
Ian Slater <[log in to unmask]>
Parts/Attachments:
text/plain (28 lines) 
We are having trouble with insufficient solder on both a TS 040 and
a TQFP.  Does anyone have a recommendation for optimum pad
sizing?

TS 040
Pitch: 0.020"
Foot Length:    0.020" - 0.028"


TQFP
Pitch: 0.031"
Foot Length: 0.018" - 0.022"
Lead Width: 0.008"

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