We use convection also, but I've seen some operations recently
with vapor phase.

Vapor phase works great.  Very efficient heat transfer, which is
good when you have lots of thermal mass.  Maximum temperature is
limited to the boiling point of the fluid.

On the downside, older models without good preheat can cause 
serious thermal shock.  The perfluorinated chemistry is expensive
and has high ozone depletion potential.

Joe Kane
BAE Systems
Johnson City, NY


-----Original Message-----
From: Malewicz Wesley [mailto:[log in to unmask]] 
Sent: Monday, October 24, 2005 2:09 PM
To: [log in to unmask]
Subject: [LF] Vapor Phase Reflow Soldering vs. Convection Reflow
Soldering


Hello all,

We are currently evaluating an EMS provider who is currently using a
Vapor Phase Reflow system.  I am most familiar with the Convection
Reflow system and would like information from any one who can provide me
with a pros and cons between these two types of soldering systems.

 Being a Medical products manufacturer, we are concerned that some BGA
type components in the near future will not be available with solder
balls containing Lead.  Some new components already are only available
as Lead Free.  As a result on new designs, we now have a mix of these
types of components.  We are handling this by processing the PCB through
the conventional Lead soldering process and adding the Lead Free BGA
components through a work process.

Any information you can provide on the pros and cons will be
appreciated.

Thank you,

Wes

Tel: +1 978-907-7776
Fax: +1 978-907-6489
E-mail: [log in to unmask] <mailto:[log in to unmask]
<mailto:[log in to unmask]> >




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