Subject: | |
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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 12 Jan 2005 21:38:54 -0500 |
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I've read the analysis procedure and hope I'm not the only one that is
confused.
When you look at Section 6.5 it tells you to start grinding/milling &
homogenizing the sample before you start the analysis.
What if you have a PWB assembly? If you mill it down to a homogenous
mess, and still detect a ppm level of Pb, who is to say if that level of
Pb is acceptable or not? It would depend what you use for a denominator
to calculate the %? To a particular component? Which?
This seems to make me believe that we can never just grind down a
complete PWB assembly and do a compliance analysis.
You almost have to analyze each "homogenous" portion of each component,
used to make that assembly, right?
But to me that seems to be even too oppressive for this RoHS
legislation?
Can anyone tell me what they suspect the real deal here is?
Rich K / KEDS
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of James, Chris
Sent: Wednesday, December 08, 2004 7:18 AM
To: [log in to unmask]
Subject: [LF] FW: RoHS Compliance test methods
Soldertec have announced draft IEC document on test techniq FAYI
Soldertec have announced draft IEC document on test techniques
applicable to RoHS compliance
http://www.tintechnology.biz/soldertec/soldertec.aspx?page_id=3016
If you follow the link there is the 79 page PDF document on test
procedures and a PDF form for making comments
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