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January 2005

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Subject:
IPC-1066 question: Lead content in steel and Aluminum
From:
Ken Patel <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 6 Jan 2005 10:05:16 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (40 lines) 
Experts,

I have a questions based on IPC-1066. This document says that ...



This standard shall not apply to:

* Lead as an alloying element in steel containing up to 0.35% lead by
weight, aluminum containing up to 0.4% lead by weight and as a copper alloy
containing up to 4% lead by weight.

* Lead in electronic ceramic parts (e.g., piezoelectronic devices).



Questions:

Only electronics components are affected and not sheet metal parts used in
building modules such as base plate which is made of steel. Am I correct as
we do use base plate made of steel at module level? Or do we need ask for
RoHS compliance steel and aluminum.



Re,

Ken Patel




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