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October 2005

Leadfree@IPC.ORG

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 11 Oct 2005 19:22:33 -0500
Content-Type:
text/plain
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text/plain (64 lines)
J-STD-033B Packaging/Handling of MSDs (abbreviated title) has passed
ballot and is being prepared for publication, probably won't be
available until early November because of backlog for IPCWorks.

J-STD-020D Classification of MSDs is working draft.

www.ipc.org/status and click the link on the J-STD-020D to see the draft
from earlier this year. Not much has changed since then although the
joint IPC/JEDEC committees are meeting this week.

Jack


Jack Crawford, IOM
IPC Director Certification and Assembly Technology 
[log in to unmask] 
847-597-2893 
FAX  847-615-5693 
3000 Lakeside Drive, Suite 309 S
Bannockburn, IL, 60015

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Kanaiyalal Patel
Sent: Tuesday, October 11, 2005 7:10 PM
To: [log in to unmask]
Subject: [LF] Leadfree Processing temp requirement

All,
Has IPC modified the document related to component spec from process
point of view such as reflow and wave. I forgot the document number.

This document is being used by supplier/manufacturer to make parts that
can withstand needed Leadfree reflow/wave temperature. Few of my
suppliers' parts are rated around 240c max and I think that is too low
for leadfree process. Can someone provide the temp numbers withour
buying a IPC spec for urgent requirements?

Any help will be appreciated.

re,
ken Patel


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-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
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Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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