IPC New Release: J-STD-020E

Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=87a00a4d-b6a8-e411-943b-000d3a600abc>



IPC JEDEC J-STD-020 is used to determine what moisture-sensitivity-level (MSL) classification level should be used so that surface mount devices (SMDs) can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder reflow attachment and/or repair operation. J-STD-020 covers components to be processed at higher temperatures for lead-free and lower temperature Sn-Pb assemblies.



In this revision, clarification was added in numerous areas to ensure consistency in scope and application. The standard incorporates considerations for bare-die with polymer and non-IC package usage. Revision E also clarifies/updates Classification Temperature (Tc), package volume, dry weight characterization, and recording with suggested intervals during dry weight determination. Guidance on bake time is also provided in the case that bake test interruption is observed.



Preview the table of contents <http://www.ipc.org/TOC/IPC-JEDEC-J-STD-020E.pdf> .pdf file.



Hard copy:

Member Price:                 $37.00

Nonmember Price:          $75.00





IPC New Release:  T-50K-DE

Begriffe und Definitionen für Leiterplatten und elektronische Baugruppen (German language)<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=4eb95dac-f6ab-e411-943b-000d3a600abc>



Das unentbehrliche Nachschlagewerk für alle Verantwortlichen entlang der Wertschöpfungskette von elektronischen Produkten. Die Revision K enthält auf mehr als 120 Seiten, mehr als 220 neue und überarbeitete Begriffe und bildliche Darstellungen. Beispiele: Access Hole, Accelerated Equivalent Soak, Capture Land, Micro Via Technology, Plating Thief, Etchback, Resin Recession, Tape Automated Bonding. In der Elektronikindustrie übliche Abkürzungen sind zusätzlich enthalten. Veröffentlichung 2013. Übersetzung Oktober 2014.



Beschreibungin Englisch<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=ea55aab6-ebee-e211-8cd2-00155dad3900>.



Hard copy:

Member Price:                 $106.00

Nonmember Price:          $212.00



挠性印制板设计分标准 (Chinese language)<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3bb15c64-54ad-e411-943d-000d3a600abc>

简要介绍 （英文）<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f1d3f05-7e1f-e111-b2f9-00155d05285c>

与IPC-2221结合使用，IPC-2223建立了挠性印制电路及其元器件安装方式和互连结构设计的专用要求。互连结构中所使用的挠性材料包括绝缘薄膜、增强和/或非增强的介质金属材料。C修订版对弯曲、折叠和褶痕、交错叠层结构、应变消除片提出了新的设计指南和要求，在挠性电路的材料选择、尺寸和外形及制作余量方面也提供了新的设计指南。共39页。2011年发布。2014年10月翻译。

预览本标准目录<http://www.ipc.org/TOC/IPC-2223C-Chinese.pdf>.（PDF文件)

Hard copy:

Member Price:                 $54.00

Nonmember Price:          $108.00





IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing [log in to unmask]<mailto:[log in to unmask]> within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.





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