IPC-9504
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning
Non-IC Components)

This document is another in a series and specifically addresses preconditioning of
non-IC components used in electronic assembly.  Do the components work with your
process?  That determination is the goal of these manufacturing process simulations;
to ensure that the components chosen meet expected reliability requirements after
exposure to factory processes.  Developed for users and manufacturers, the procedure
consists of a set of simulations, for non-IC component storage and use, wave and
reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes,
and exposure to often-used cleaning materials.  19 pages.  Released June 1998.

IPC Member:  $20                       Nonmember:  $40

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