Land and Conductor Repair - for Electronic Assemblies

Two video series explains common repair techniques for printed circuit assemblies.
Each procedure includes damage analysis, industry approved repair procedures and
evaluation criteria. Tape A covers: laminate damage repair; rebonding isolated
surface mount lands using adhesive bonding film and adhesive backed replacement
lands, and rebonding lifted conductors using liquid epoxy/overbond. Tape B covers:
conductor replacement - with adhesive backed material and liquid epoxy; repairing
gaps in conductors; replacing straight and bent conductors; surface mount
land/conductor replacement with adhesive backed material; and solder mask
replacement. 2 videotapes, includes Leader's Guides and Student Workbooks. Time. 57
minutes.

IPC-VT-97A/B
Member $375 (PAL format $412)
Nonmember $475 (PAL format $522.50)

################################################################
IPC_New_Releases E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE IPC_New_Releases <your full name>
To unsubscribe:   SIGNOFF IPC_New_Releases 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################