Land and Conductor Repair - for Electronic Assemblies Two video series explains common repair techniques for printed circuit assemblies. Each procedure includes damage analysis, industry approved repair procedures and evaluation criteria. Tape A covers: laminate damage repair; rebonding isolated surface mount lands using adhesive bonding film and adhesive backed replacement lands, and rebonding lifted conductors using liquid epoxy/overbond. Tape B covers: conductor replacement - with adhesive backed material and liquid epoxy; repairing gaps in conductors; replacing straight and bent conductors; surface mount land/conductor replacement with adhesive backed material; and solder mask replacement. 2 videotapes, includes Leader's Guides and Student Workbooks. Time. 57 minutes. IPC-VT-97A/B Member $375 (PAL format $412) Nonmember $475 (PAL format $522.50) ################################################################ IPC_New_Releases E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE IPC_New_Releases <your full name> To unsubscribe: SIGNOFF IPC_New_Releases ################################################################ Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information. For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311 ################################################################