TR-465-3 (e)
CD-ROM Evaluation of Steam Aging on Alternative Finishes, Phase 11A
Details the results of a two year study to determine the effect of steam aging
exposure on components.  A variety of solderable finishes were used.  Among the
conclusions: Steam age conditioning had a measurable effect on all the components
tested.  The tests clearly identified parts with undesirable surface anomalies.
Steam age conditioning on PWB solder float tests had a marginal effect on as-received
samples, but added on average 4% dewet area to degraded samples.  For both the
component and printed wiring board measurements, test location had a large effect.  A
small production simulation using precondition and as-received samples in which a
total of 2,000 joints were tested showed no defects.  Based on this sample the defect
rate for this simulation would probably be 350 ppm or less.  15 pages.  Released
September 1998.

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