TR-465-3 (e) CD-ROM Evaluation of Steam Aging on Alternative Finishes, Phase 11A Details the results of a two year study to determine the effect of steam aging exposure on components. A variety of solderable finishes were used. Among the conclusions: Steam age conditioning had a measurable effect on all the components tested. The tests clearly identified parts with undesirable surface anomalies. Steam age conditioning on PWB solder float tests had a marginal effect on as-received samples, but added on average 4% dewet area to degraded samples. For both the component and printed wiring board measurements, test location had a large effect. A small production simulation using precondition and as-received samples in which a total of 2,000 joints were tested showed no defects. Based on this sample the defect rate for this simulation would probably be 350 ppm or less. 15 pages. Released September 1998. IPC Member Nonmember Single-user $30 $60 5-user $100 $200 20-user $200 $400 Site $700 $1,400 Global $1,400 $2,800 ################################################################ IPC_New_Releases E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE IPC_New_Releases <your full name> To unsubscribe: SIGNOFF IPC_New_Releases ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################