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1998

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Subject:
Re: [IPC New Release] IPC-TM-650 Update
From:
Christopher Jorgensen <[log in to unmask]>
Reply To:
Christopher Jorgensen <[log in to unmask]>
Date:
Mon, 11 May 1998 10:43:02 -0500
Content-Type:
text/plain
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text/plain (67 lines) 
IPC announces the March 1998 update to IPC-TM-650. The second update to IPC-TM-650 in
the past six months offers two new test methods and six revised methods. 

The following list of test methods is the March 1998 IPC-TM-650 update. "Reaffirmed"
indicates that the test method was not revised, but was reaffirmed for accuracy.

2.5.6.2A ¯ Reaffirmed ¯  Electric Strength of Printed Wiring Material
2.1.1D Microsectioning
2.4.42.2 Die Shear Strength
2.4.42.3 Bond Strength (Destructive Bond Pull Strength)
2.6.8D Thermal Stress, Plated Through-Holes
2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and
Dissipation Factor) at X-Band
2.5.5.5.1A Stripline Test for Complex Relative Permittivity of Circuit Board
Materials from Below 1 GHz up to 14 GHz
2.4.44 ¯ Reaffirmed ¯  Solder Paste - Tack Test
2.4.28.1C Adhesion, Solder Resist (Mask), Tape Test Method

In October 1997 the IPC released an IPC-TM-650 updated that consisted of 34 revised
test methods and 13 new methods.

Chair of Test Methods Subcommittee: Susan Mansilla, Robisan Laboratories, Inc.

IPC-TM-650 ¯ Two year update service is included.
$200 member / $400 nonmember

It is available through the IPC:
phone-  847.509.9700
fax-  847.509.9819
email-  [log in to unmask] 
URL-  www.ipc.org 

                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                                                     
                                                       

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