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Date: | Mon, 11 May 1998 10:43:02 -0500 |
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IPC announces the March 1998 update to IPC-TM-650. The second update to IPC-TM-650 in
the past six months offers two new test methods and six revised methods.
The following list of test methods is the March 1998 IPC-TM-650 update. "Reaffirmed"
indicates that the test method was not revised, but was reaffirmed for accuracy.
2.5.6.2A ¯ Reaffirmed ¯ Electric Strength of Printed Wiring Material
2.1.1D Microsectioning
2.4.42.2 Die Shear Strength
2.4.42.3 Bond Strength (Destructive Bond Pull Strength)
2.6.8D Thermal Stress, Plated Through-Holes
2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and
Dissipation Factor) at X-Band
2.5.5.5.1A Stripline Test for Complex Relative Permittivity of Circuit Board
Materials from Below 1 GHz up to 14 GHz
2.4.44 ¯ Reaffirmed ¯ Solder Paste - Tack Test
2.4.28.1C Adhesion, Solder Resist (Mask), Tape Test Method
In October 1997 the IPC released an IPC-TM-650 updated that consisted of 34 revised
test methods and 13 new methods.
Chair of Test Methods Subcommittee: Susan Mansilla, Robisan Laboratories, Inc.
IPC-TM-650 ¯ Two year update service is included.
$200 member / $400 nonmember
It is available through the IPC:
phone- 847.509.9700
fax- 847.509.9819
email- [log in to unmask]
URL- www.ipc.org
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