IPC-9504
Assembly Process Simulation for Evaluation of Non-IC Components

This document is another in a series and specifically addresses Non-Integrated
Circuit Components.  Do the components work with your process?  That determination is
the goal of these manufacturing process simulations; to ensure that the components
chosen meet expected reliability requirements after exposure to factory processes.
Developed for users and manufacturers, the procedure consists of a set of
simulations, for components storage and use, wave and reflow soldering (SMT and PTH
parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used
cleaning materials.  36 pages.  Released June 1998.

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