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Date: | Thu, 15 Oct 1998 09:44:40 -0500 |
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IPC-9504
Assembly Process Simulation for Evaluation of Non-IC Components
This document is another in a series and specifically addresses Non-Integrated
Circuit Components. Do the components work with your process? That determination is
the goal of these manufacturing process simulations; to ensure that the components
chosen meet expected reliability requirements after exposure to factory processes.
Developed for users and manufacturers, the procedure consists of a set of
simulations, for components storage and use, wave and reflow soldering (SMT and PTH
parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used
cleaning materials. 36 pages. Released June 1998.
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