IPC_NEW_RELEASES Archives

February 2005

IPC_New_Releases@IPC.ORG

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From:
Michelle Jorgensen <[log in to unmask]>
Reply To:
Michelle Jorgensen <[log in to unmask]>
Date:
Wed, 9 Feb 2005 14:25:12 -0600
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The following IPC products have now been released.  To place your order,
click on the links below, which will take you to the Online Store
<http://www.ipc.org/onlinestore>  for quick and easy purchasing, or
contact IPC's Customer Service Department <mailto:[log in to unmask]>
Monday through Friday, 9:00 am - 5:00 pm CST at 847-597-2862. 

 

 

IPC-OVT-20/21, Reflow Soldering 

Now you can purchase an online training tool especially designed to
explain the different types of reflow soldering processes, including
I/R, convection, and convection I/R. Also covers solder pastes, creams,
and fluxes. OVT-20/21 provides a detailed study of thermal profiles for
reflow soldering. This program includes ESD protection, process
contamination, and handling considerations. Also demonstrates how
solder, flux and components are applied to the board. 

 

SITE:                           GLOBAL:

 

Members:                                 $562.00
$1686.00

Nonmembers:                          $712.00
$2136.00

 

IPC-OVT-34, Solder Paste Printing 

Now you can purchase an online training tool that introduces the key
elements in solder paste printing: the circuit board, stencil, solder
paste and squeegee. OVT-34 describes how each element affects the
printing process. The program discusses automatic and semiautomatic
stencil printers, focusing on what the operator needs to understand to
set up and monitor all aspects of the printing operation. This training
concludes with a description of general operator maintenance,
emphasizing safety and proper clean-up and is the first of a two-part
series (with the upcoming OVT-35-K, Solder Paste Printing-Defect
Analysis & Prevention).   See pricing below. ***

 

IPC-OVT-33, Introduction to Surface Mount Assembly 

Now you can purchase an online training tool especially designed to
provide an introductory overview of the entire surface mount assembly
process. OVT-33 begins with a review of component evolution from
through-hole to surface mount, then describes standard component types.
The program explains the solder paste printing process; mixed technology
assemblies -- including adhesive application, auto placement of
components, reflow soldering, infrared (convection and combination),
visual inspection, cleaning, secondary reflow, electrical and burn-in
testing.  See pricing below.***

 

IPC-OVT-27, Introduction to Through-Hole Assembly 

Now you can purchase an online training tool especially designed to
provide an introductory overview of the through-hole assembly processes.
It begins with a description of the basic functions of typical
components and interconnections; component location grids; letter codes
and polarity markings. It provides a visual explanation of DIP
insertion, axial insertion, lead preforming/manual insertion. Also
reviews wave soldering, hand soldering, cleaning and testing. Discusses
common problems to avoid, and stresses the importance of the individual
operator throughout the process.  See pricing below.***

 

IPC-OVT-14, Hand Soldering for Terminals 

Now you can purchase an online training tool especially designed to
visually explain the tinning of soldering iron tips, stripping of
insulated wire, as well as tinning the wire and cleaning the tip. Also
demonstrates the proper method of attaching and soldering wires to
turret terminals, cup terminals, bifurcated terminals, hook terminals,
and pierced terminals. This program discusses the importance of
soldering for inspectability. Provides acceptance criteria for preferred
solder joints, and demonstrates minimum / maximum conditions. See
pricing below.***

 

IPC-OVT-11, General Safety in Electronic Assembly 

Now you can purchase an online training tool especially designed to
introduce operators to safety in electronics assembly. Covers personal
protective wear, including safety glasses, shoes, long hair, etc.; how
to avoid personal injury from cuts and burns; prevention of "cumulative
trauma disorders;" proper lifting technique; lead exposure and soldering
fumes; an introduction to HazMat and MSDS; electrical safety, warning
systems, and the importance of good housekeeping. This program stresses
the importance of operator knowledge and attitude to avoid personal
injury.  See pricing below.***

__________________________________________________

OVT PRODUCTS

With the added convenience of 24/7 access from any workstation
throughout your facility, our new Online Video Training
<http://training.ipc.org/html/ovt.htm>  (OVT) program delivers video on
demand, over your network infrastructure, or over your intranet - for
distance learning applications. Now, any computer in your organization
can be an instant online training center! It's cost-effective and
easy-to-implement.

Train an unlimited number of students at your facility (Site License) or
train throughout all your company facilities - even international sites
(Global License).  Each program includes a downloadable leader's Guide
and Student Workbook. 

***OVT PRICING:

SITE:                           GLOBAL:

 

Members:                                 $412.00
$1236.00

Nonmembers:                          $525.00
$1575.00

 

 

IPC-ELEC-ELEC, Implementing Lead-Free Electronics 

This reference book provides timely information on the choices and
tradeoffs facing manufacturers seeking the most efficient and
cost-effective ways to meet the challenge of converting to lead-free
manufacturing. The book is laid out as a quick guide, providing
successful examples in conjunction with the basic principles of the
implementation and production of lead-free electronics on a global
basis. This book shares the knowledge gained from the author's 15-year
lead-free development leadership and her 25-year real-world SMT
manufacturing experience.

An impressive, unparalleled resource for manufacturing technology in the
electronics/microelectronics industry, with real-world application
value, this is a must for all involved in research, manufacturing, and
decision-making management. Topics include: Manufacturing Approaches;
Selecting Interconnecting Solder Alloy; Selecting Component Coating;
Selecting PCB Surface Finish; Solder Paste Application; Reflow
Soldering; Wave Soldering; Other Manufacturing Techniques and Common
Defect Considerations and System Reliability and Compatibility. Written
by Dr. Jennie S. Hwang, McGraw-Hill. 466 pages. Released 2005.

HARD COPY

Members:                               $100.00

Nonmembers:                        $125.00

 

           

IPC-1066, Marking, Symbols and Labels for Identification of Lead-Free
and Other Reportable Materials in Lead-Free Assemblies, Components and
Devices 

This standard establishes the requirements for a distinctive symbol and
labels to be used to identify materials that are lead free (Pb-free) and
are capable of providing Pb-free second level interconnects, and for
indicating certain types of Pb-free materials and the maximum allowable
soldering temperature. It also establishes the requirements for labeling
a bare board if the base resin is halogen free and the type of conformal
coating used after assembly. 20 pages. Published December 2004. This
document may be purchased in hard copy or downloaded for FREE.

 

 

HARD COPY

Members:                               $15.00

Nonmembers:                        $30.00

 

 

 

IPC-1065, Material Declaration Handbook 

This handbook has been developed to aid printed circuit board (PCB)
manufacturers and users in completing Material Declarations that follow
the format and guidance of the Joint Industry Material Composition
Declaration Guide. It includes information on what a manufacturer should
do when a materials declaration request is received; a list of chemical
substances likely to be found in a PCB; simplified sample calculations
for a material declaration of a PCB; guidelines for determining the
composition of an electronic product using analytical techniques.
Appendices include a table of chemical lists and laboratory analysis
methods; detailed calculation of a material declaration of a PCB;
uncertainty of calculated data values; a list of analytical
laboratories; a list of relevant documents; and analytical techniques
for substances removed from the final version of the joint industry
guide. 72 pages. Released January 2005.

 

                                      HARDCOPY:            DOWNLOAD or
CD:             KIT:

Members:                       $30.00                          $35.00
$45.00  

Nonmembers:                $60.00                          $65.00
$90.00

 

 

 

 

 

 

 

 

 

 

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