As Nick points out, in regard to Flex, we feel we can incorporate all the
pertinent 6016 requirements/characteristics into 6013, therefore, we would
have no need for it once this is accomplished. As previously stated, 6016 is
also over 11 years old and although some characteristics are still valid,
others are not. Once 6013 and 6012 are updated to include 6016
requirements, it should be obsolete.
Regards,
Tom Gardeski
Flex General Chair
In a message dated 2/3/2011 2:21:38 P.M. US Mountain Standard Time,
[log in to unmask] writes:
Joey,
In the flex world , 6016 is rarely called out. We follow IPC-6013 and
identify HDI specific issues in the procurement documentation. I have been
leading an update of IPC-6013 to incorporate HDI characteristics and
effectively obsolete 6016. We are working with the IPC-6012 committee as well to
have a consistent transition of HDI attributes into both specs. Once done,
we can put the 6016 spec to rest.
I agree with Scott that IPC-6016 is not very relevant anymore.
Regards,
Nick
Nick Koop
Minco Products, Inc
Flex Circuits Product Marketing Manager
Ph 763 586-2846
Mobile 763 245-4825
>>> Scott Bowles <[log in to unmask]> 2/3/2011 2:09 PM >>>
Joey,
Some like to go with what fits their need at the time and will use
"implied" even stating that IPC-6016 "should" be invoked any time a design has
microvias even if 6016 isn't referenced at all in the procurement
documentation. The bottom line is that the board fabricators are required to build to
the requirements of the procurement documentation.
We should be putting pressure on IPC to obsolete IPC-6016 and add any
necessary "HDI" requirements into the next revision of IPC-6012. IPC-6016 is
over 11 years old and in my opinion there is no real need for a separate
document.
FYI, 6016 does have the requirement for 5x thermal stress cycles (unless
limited by the number of stress cycles acceptable for the core board -
whatever that is supposed to mean).
Best regards,
Scott A. Bowles
Director of Engineering and Quality
Hallmark Circuits, Inc.
13500 Danielson Street
Poway, CA 92064
858 513-2200 Office x8848
858 513-2233 Fax
858 437-7827 Cell
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]]On Behalf Of Jose A Rios
Sent: Thursday, February 03, 2011 9:55 AM
To: [log in to unmask]
Subject: [IPC-600-6012] 6012 & 6016
6012C section 1.2, item 3 implies that 6016 always applies to rigid boards
containing HDI features.
We see designs with HDI features with mixed callouts: some 6012 only,
others 6012 & 6016.
Are both callouts to be treated equally?? I believe so, but I'd like to
see how others interpret the above.
Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896
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