Greetings to all
I would like to start a discussion of the Thermal stress testing called for in para 3.6.1 of IPC-6018 (HDI).  It states

Printed boards using HDI shall be preconditioned and tested in accordance with IPC-TM-650, Method 2.6.8, Test condition B (500F).  The number of cycles shall be 5 (unless limited by the number of stress cycles acceptable for the core board).

So - we get in coupons or boards that have both through hole and HDI construction.  We have been performing the above test on the area containing the HDI holes and then the regular 2.6.8 (550F/10 sec/1 time) on the area containing the through holes.

That really doesn't make much sense to me, since I don't think the boards will be assembled in the same manner.

Your thoughts would be appreciated.  My intent is to try and have the two documents agree and not have such different tests for the same board.

Susan 

Susan Hott
President
Robisan Laboratory, Inc
6502 E 21st Street
Indianapolis, IN 46219

317-353-6249 phone
317-917-2379 fax

www.robisan.com