Susan,

We perform this test for some of our customers and through discussing
this with them and their end-users we have concluded to only perform the
5x thermal stress in both the HDI and Through-Hole locations.

You are right that it would not make sense, for instance, to perform
both stress tests and have the through-hole areas meet the requirements
and the HDI fail, or vice-versa. The through-hole locations would have
to meet the worst-case scenario of the HDI portion.  

Best Regards,
 
Russ Shepherd
Laboratory Manager
Microtek Laboratories
(714) 999-1616
[log in to unmask]

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Susan Hott
Sent: Wednesday, April 18, 2007 7:51 AM
To: [log in to unmask]
Subject: [IPC-600-6012] Thermal Stress Testing for 6016 and 6012

Greetings to all
I would like to start a discussion of the Thermal stress testing called
for in para 3.6.1 of IPC-6018 (HDI).  It states

Printed boards using HDI shall be preconditioned and tested in
accordance with IPC-TM-650, Method 2.6.8, Test condition B (500F).  The
number of cycles shall be 5 (unless limited by the number of stress
cycles acceptable for the core board).

So - we get in coupons or boards that have both through hole and HDI
construction.  We have been performing the above test on the area
containing the HDI holes and then the regular 2.6.8 (550F/10 sec/1 time)
on the area containing the through holes.

That really doesn't make much sense to me, since I don't think the
boards will be assembled in the same manner.

Your thoughts would be appreciated.  My intent is to try and have the
two documents agree and not have such different tests for the same
board.

Susan 

Susan Hott
President
Robisan Laboratory, Inc
6502 E 21st Street
Indianapolis, IN 46219

317-353-6249 phone
317-917-2379 fax

www.robisan.com

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