John,

        This looks like the type of crack that Phil Henault was lobbying 
to get put into IPC-A-600.   The crack is within a glass fiber bundle, not 
at the "knuckle".   We consider this to be a laminate defect.

Thanks,
Lance





From:
John Perry <[log in to unmask]>
To:
[log in to unmask]
Date:
01/28/2010 05:40 PM
Subject:
[IPC-600-6012] Bundle Crack in Microsection
Sent by:
IPC-600-6012 <[log in to unmask]>



Hi Everyone,

We've got a request for feedback on the anomaly in the attached .ppt file 
which was detected in one bundle of glass in a coupon.  This is in the 
center of the board stack, which is a 24 layer construction.  Since it is 
in the core material it may be related to glass non-wetting of the resin 
or poor glass treatment.

I'd also like to know if this is something we can consider developing 
criteria for in the next generation of IPC-6012/A-600 when we meet in Las 
Vegas in a couple months.

Regards,

John Perry
Technical Project Manager
IPC - Association Connecting Electronics Industries(r)
3000 Lakeside Drive # 309S
Bannockburn, IL 60015-1249 USA
+1 847-597-2818 (tel)
+1 847-615-7105 (fax)
+1 847-615-7100 (Main)
[log in to unmask]
www.ipc.org


[attachment "Bundle crack.ppt" deleted by Lance A Auer/US/Raytheon] 


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