Hi John,

I remember when we were writing paragraph 3.5.4.6 that we only had plating
finish in mind (not coating finish).  We need to make sure it is clear what
we are talking about in paragraph 3.5.4.6 in the new rev.

Best regards,
Renee Michalkiewicz
Laboratory Director
Trace Laboratories - East
5 North Park Drive
Hunt Valley, Maryland 21030
phone: 410-584-9099
Fax:    410-584-9117
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-----Original Message-----
From: John Perry [mailto:[log in to unmask]]
Sent: Wednesday, May 08, 2002 5:46 PM
To: [log in to unmask]
Subject: [IPC-600-6012] EXPOSED COPPER/FINAL FINISH


Do we have a conflict here within the IPC-6012a?


In IPC-6012a, Section 3.5.4.6, it states that exposed copper on areas not to
be soldered is permitted on 1% of the conductor surfaces for Class 3 and 5%
of the surfaces for Class 1 and Class 2.

But, Section 3.8.1 Solder Resist Coverage sub-paragraph a.  states "Metal
conductors shall not be exposed or bridged by blisters in areas where solder
resist is required."

The percent allowance issue has been discussed before at Expo 2001 but we
did not walk away from that meeting with a clear cut definition of what
constitutes X percentage on a board, let alone potential conflict with
section 3.8.1.

Best Regards,



John Perry
Technical Project Manager
IPC
2215 Sanders Road
Northbrook, Il 60062
1-847-790-5318 (P)
1-847-509-9798 (F)
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