Hi John, I remember when we were writing paragraph 3.5.4.6 that we only had plating finish in mind (not coating finish). We need to make sure it is clear what we are talking about in paragraph 3.5.4.6 in the new rev. Best regards, Renee Michalkiewicz Laboratory Director Trace Laboratories - East 5 North Park Drive Hunt Valley, Maryland 21030 phone: 410-584-9099 Fax: 410-584-9117 [log in to unmask] <mailto:[log in to unmask]> Notice: This message is intended for the private use of the addressee. If this e-mail transmission was sent to you in error, please notify the originator. -----Original Message----- From: John Perry [mailto:[log in to unmask]] Sent: Wednesday, May 08, 2002 5:46 PM To: [log in to unmask] Subject: [IPC-600-6012] EXPOSED COPPER/FINAL FINISH Do we have a conflict here within the IPC-6012a? In IPC-6012a, Section 3.5.4.6, it states that exposed copper on areas not to be soldered is permitted on 1% of the conductor surfaces for Class 3 and 5% of the surfaces for Class 1 and Class 2. But, Section 3.8.1 Solder Resist Coverage sub-paragraph a. states "Metal conductors shall not be exposed or bridged by blisters in areas where solder resist is required." The percent allowance issue has been discussed before at Expo 2001 but we did not walk away from that meeting with a clear cut definition of what constitutes X percentage on a board, let alone potential conflict with section 3.8.1. Best Regards, John Perry Technical Project Manager IPC 2215 Sanders Road Northbrook, Il 60062 1-847-790-5318 (P) 1-847-509-9798 (F) [log in to unmask]