Agree with Jim and Joe - unless otherwise specified we only count the
external layer copper thicknesses for cap plate.  Have been questioned
on the past from independent Lab on the internal cap thickness when
submitting DSCC samples and have had to get customer clarification in
which they have also stated that it is external layer only.

Denise J Chevalier
Amphenol Printed Circuits
Quality Engineer
Phone - 603-324-4530
Fax - 603-386-6442
 
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Lance A
Auer
Sent: Wednesday, February 09, 2011 6:47 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] buried cap thickness

Chris,

        When there requirements are specified so vaguely, I think the 
manufacturer needs to contact his customer to determine what he actually

wants.

Lance
 




From:
"Monarchio, James" <[log in to unmask]>
To:
[log in to unmask]
Date:
02/09/2011 03:09 PM
Subject:
Re: [IPC-600-6012] buried cap thickness
Sent by:
IPC-600-6012 <[log in to unmask]>



Also the fill material may be the resin from lamination, I which case
the via could not be cap plated internally.

Jim

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A
Rios
Sent: Wednesday, February 09, 2011 4:57 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] buried cap thickness

unless the design specifically calls out buried caps, we tend to not cap

plate internals.

a generic note like what you cite below "fill, planarize, cap" we tend
to 
only apply it to externals.

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



Chris Mahanna <[log in to unmask]> 
Sent by: IPC-600-6012 <[log in to unmask]>
02/09/2011 04:38 PM
Please respond to
"(Combined Forum of D-33a and 7-31a Subcommittees)"
<[log in to unmask]>


To
[log in to unmask]
cc

Subject
[IPC-600-6012] buried cap thickness






I assume that we purposely did not include a caveat for buried cap 
thickness in 6012C?

My particular interest is the case where the design predates 6012C and 
gives no more specifics than: "fill, planarize and cap"

Thanks
Chris

Chris Mahanna
President, Technical Manager
Robisan Laboratory Inc.
6502 E. 21st Street
Indianapolis, Indiana 46219
317-353-6249


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