Agree with Jim and Joe - unless otherwise specified we only count the external layer copper thicknesses for cap plate. Have been questioned on the past from independent Lab on the internal cap thickness when submitting DSCC samples and have had to get customer clarification in which they have also stated that it is external layer only. Denise J Chevalier Amphenol Printed Circuits Quality Engineer Phone - 603-324-4530 Fax - 603-386-6442 CONFIDENTIALITY NOTICE: This email message, including any attachments, is for the sole use of the intended recipient(s) and contains confidential and privileged information. Any unauthorized review, use, disclosure or distribution is prohibited. If you are not the intended recipient, please reply to the sender by email and destroy all copies of the original message. EXPORT CONTROL NOTICE: This email transmission contains information controlled for export purposes under the U.S. International Traffic in Arms Regulations (ITAR) and is intended for the recipient only. No export, sale, transfer, release or other disposition of this information is permitted without prior authorization from the U.S. Government. -----Original Message----- From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Lance A Auer Sent: Wednesday, February 09, 2011 6:47 PM To: [log in to unmask] Subject: Re: [IPC-600-6012] buried cap thickness Chris, When there requirements are specified so vaguely, I think the manufacturer needs to contact his customer to determine what he actually wants. Lance From: "Monarchio, James" <[log in to unmask]> To: [log in to unmask] Date: 02/09/2011 03:09 PM Subject: Re: [IPC-600-6012] buried cap thickness Sent by: IPC-600-6012 <[log in to unmask]> Also the fill material may be the resin from lamination, I which case the via could not be cap plated internally. Jim -----Original Message----- From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Jose A Rios Sent: Wednesday, February 09, 2011 4:57 PM To: [log in to unmask] Subject: Re: [IPC-600-6012] buried cap thickness unless the design specifically calls out buried caps, we tend to not cap plate internals. a generic note like what you cite below "fill, planarize, cap" we tend to only apply it to externals. Joey Rios PWB & Process Quality Eng'r Endicott Interconnect Technologies 1093 Clark St. Endicott, NY 13760 Office: 607-755-5896 Chris Mahanna <[log in to unmask]> Sent by: IPC-600-6012 <[log in to unmask]> 02/09/2011 04:38 PM Please respond to "(Combined Forum of D-33a and 7-31a Subcommittees)" <[log in to unmask]> To [log in to unmask] cc Subject [IPC-600-6012] buried cap thickness I assume that we purposely did not include a caveat for buried cap thickness in 6012C? My particular interest is the case where the design predates 6012C and gives no more specifics than: "fill, planarize and cap" Thanks Chris Chris Mahanna President, Technical Manager Robisan Laboratory Inc. 6502 E. 21st Street Indianapolis, Indiana 46219 317-353-6249 ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ NOTICE: This email message is for the sole use of the intended recipient(s) and may contain confidential and privileged information. Any unauthorized review, use, disclosure or distribution is prohibited. If you are not the intended recipient, please contact the sender by reply email and destroy all copies of the original message. ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________ ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________