?Embedded Active Components and Integrated Passive: Technologies and 
Markets,? report released by TechSearch International 
SMT
(January 25, 2008) AUSTIN, Texas - TechSearch International released 
?Embedded Active Components and Integrated Passive: Technologies and 
Markets,? a report detailing the technologies, processes, and 
infrastructure for embedded components. TechSearch expects embedded 
components to see double-digit growth across market segments in coming 
years. 
Formed and placed embedded components in printed circuits - packages or 
PCBs - can reduce product costs, enable more features, reduce size, and 
improve performance, according to TechSearch. The technique also helps 
lower product weight, and can improve reliability and reduce solder joint 
counts. These elements promote embedded designs for military and medial, 
consumer and mobile, and automotive applications, TechSearch reports. 
Consortia and development activities are global, particularly vibrant in 
Europe, the U.S., and Japan. TechSearch?s study examines demand for formed 
and placed embedded components by market and application, technical 
solutions, materials, and infrastructure of design and assembly equipment 
and services for embedded products. It also tracks the development of 
various embedding strategies and the influence of microvias. 
TechSearch will host a workshop February 25-26 in Austin, with speakers 
from materials suppliers, fabricators, and embedded component users. For 
more information, see www.techsearchinc.com. 
18)     Embedded Components Hailed the Best Thing Since the Micro-via 
Advanced Packaging
(January 25, 2008) AUSTIN, TX - The introduction of embedded components 
may be the one of the most significant developments in the electronics 
industry since the microvia, according to an international study conducted 
by TechSearch International. Findings revealed that enabled by the 
proliferation of micro-via technology, the number of products containing 
embedded active devices in the module or PCB are increasing, especially in 
consumer and mobile communication products. 
Drivers are said to be reduction in product cost, added features, reduced 
size, and improved performance. Some applications also require weight 
reduction, improved reliability, and solder joint reduction. Embedded 
technologies provide solutions as either placed or formed components. 
Embedding of active and passive devices is the focus of consortia in both 
Europe and Japan. 
A report based on the study forecasts demand for placed and formed 
embedded components in printed circuit structures, including both modules 
and PCBs, based on demand projections by market segment and application 
space. It highlights specific company activities to develop and expand 
various embedded solutions, and reviews competing technical solutions such 
as thin film on silicon and the traditional ceramic technologies. It also 
provides insight into the infrastructure established to support embedded 
solutions including design, modeling, simulation, assembly equipment and 
services, and provides a listing of fabricators offering formed or placed 
components. 
TechSearch International will host a workshop to present these findings on 
February 25 and 26 in Austin, Texas, and will feature speakers from 
materials companies, fabricators, and embedded component users. For more 
information, visit http://www.techsearchinc.com. 
19)     Embedded Components Workshop, Feb 25, 2008, Techsearch 
International
January 24, 2008 
TechSearch International Study Finds Embedded Components to be One of the 
Most Significant Developments in the Electronics Industry Since the 
MicroviaWorkshop Scheduled for February 25 and 26 in Austin, Texas.
The introduction of embedded components may be the one of the most 
significant developments in the electronics industry since the microvia. 
TechSearch Internationals new study, Embedded Active Components and 
Integrated Passives: Technologies and Markets, provides a detailed review 
of embedded active and passive component use in both chip packages and 
printed circuit boards.  The reports details the technologies and 
processes that have been developed to embed components and reviews the 
viability of the infrastructure needed to support the double-digit growth 
projected for global demand in every market segment.
The overall drivers for embedding components are reduction in product 
cost, added features, reduced size, and improved performance.  Some 
applications also require weight reduction, improved reliability, and 
solder joint reduction.  Embedded technologies provide solutions as either 
placed or formed components.   Embedding of active and passive devices is 
the focus of consortia in both Europe and Japan.  Enabled by the 
proliferation of microvia technology, the number of products containing 
placed active devices buried inside the circuit board or module is rapidly 
increasing, especially in the consumer and mobile communication space. 
The ability to form passive components that can be embedded has been the 
focus of significant development activity, especially in the United 
States.  Resistors and capacitors can be formed by incorporating 
commercially available materials into layers within the core structure, 
and microvias enable the interconnections.  The technology is used in 
military, data and telecom, mobile communication and infrastructure, and 
medical applications.  lt is also evolving in automotive electronics.
The report forecasts demand for both placed and formed embedded components 
in printed circuit structures, including both modules and PCBs, based on 
demand projections by market segment and application space.  It highlights 
specific company activities to develop and expand various embedded 
solutions.  It reviews competing technical solutions such as thin film on 
silicon and the traditional ceramic technologies.  It also provides 
insight into the infrastructure established to support embedded solutions 
including design, modeling, simulation, assembly equipment and services, 
and provides a listing of fabricators offering formed or placed 
components.
TechSearch International will host a workshop on February 25 and 26 in 
Austin, Texas that will feature speakers from materials companies, 
fabricators, and embedded component users. 
Contact: Jan Vardaman
(512) 372-8887