?Embedded Active Components and Integrated Passive: Technologies and Markets,? report released by TechSearch International SMT (January 25, 2008) AUSTIN, Texas - TechSearch International released ?Embedded Active Components and Integrated Passive: Technologies and Markets,? a report detailing the technologies, processes, and infrastructure for embedded components. TechSearch expects embedded components to see double-digit growth across market segments in coming years. Formed and placed embedded components in printed circuits - packages or PCBs - can reduce product costs, enable more features, reduce size, and improve performance, according to TechSearch. The technique also helps lower product weight, and can improve reliability and reduce solder joint counts. These elements promote embedded designs for military and medial, consumer and mobile, and automotive applications, TechSearch reports. Consortia and development activities are global, particularly vibrant in Europe, the U.S., and Japan. TechSearch?s study examines demand for formed and placed embedded components by market and application, technical solutions, materials, and infrastructure of design and assembly equipment and services for embedded products. It also tracks the development of various embedding strategies and the influence of microvias. TechSearch will host a workshop February 25-26 in Austin, with speakers from materials suppliers, fabricators, and embedded component users. For more information, see www.techsearchinc.com. 18) Embedded Components Hailed the Best Thing Since the Micro-via Advanced Packaging (January 25, 2008) AUSTIN, TX - The introduction of embedded components may be the one of the most significant developments in the electronics industry since the microvia, according to an international study conducted by TechSearch International. Findings revealed that enabled by the proliferation of micro-via technology, the number of products containing embedded active devices in the module or PCB are increasing, especially in consumer and mobile communication products. Drivers are said to be reduction in product cost, added features, reduced size, and improved performance. Some applications also require weight reduction, improved reliability, and solder joint reduction. Embedded technologies provide solutions as either placed or formed components. Embedding of active and passive devices is the focus of consortia in both Europe and Japan. A report based on the study forecasts demand for placed and formed embedded components in printed circuit structures, including both modules and PCBs, based on demand projections by market segment and application space. It highlights specific company activities to develop and expand various embedded solutions, and reviews competing technical solutions such as thin film on silicon and the traditional ceramic technologies. It also provides insight into the infrastructure established to support embedded solutions including design, modeling, simulation, assembly equipment and services, and provides a listing of fabricators offering formed or placed components. TechSearch International will host a workshop to present these findings on February 25 and 26 in Austin, Texas, and will feature speakers from materials companies, fabricators, and embedded component users. For more information, visit http://www.techsearchinc.com. 19) Embedded Components Workshop, Feb 25, 2008, Techsearch International January 24, 2008 TechSearch International Study Finds Embedded Components to be One of the Most Significant Developments in the Electronics Industry Since the MicroviaWorkshop Scheduled for February 25 and 26 in Austin, Texas. The introduction of embedded components may be the one of the most significant developments in the electronics industry since the microvia. TechSearch Internationals new study, Embedded Active Components and Integrated Passives: Technologies and Markets, provides a detailed review of embedded active and passive component use in both chip packages and printed circuit boards. The reports details the technologies and processes that have been developed to embed components and reviews the viability of the infrastructure needed to support the double-digit growth projected for global demand in every market segment. The overall drivers for embedding components are reduction in product cost, added features, reduced size, and improved performance. Some applications also require weight reduction, improved reliability, and solder joint reduction. Embedded technologies provide solutions as either placed or formed components. Embedding of active and passive devices is the focus of consortia in both Europe and Japan. Enabled by the proliferation of microvia technology, the number of products containing placed active devices buried inside the circuit board or module is rapidly increasing, especially in the consumer and mobile communication space. The ability to form passive components that can be embedded has been the focus of significant development activity, especially in the United States. Resistors and capacitors can be formed by incorporating commercially available materials into layers within the core structure, and microvias enable the interconnections. The technology is used in military, data and telecom, mobile communication and infrastructure, and medical applications. lt is also evolving in automotive electronics. The report forecasts demand for both placed and formed embedded components in printed circuit structures, including both modules and PCBs, based on demand projections by market segment and application space. It highlights specific company activities to develop and expand various embedded solutions. It reviews competing technical solutions such as thin film on silicon and the traditional ceramic technologies. It also provides insight into the infrastructure established to support embedded solutions including design, modeling, simulation, assembly equipment and services, and provides a listing of fabricators offering formed or placed components. TechSearch International will host a workshop on February 25 and 26 in Austin, Texas that will feature speakers from materials companies, fabricators, and embedded component users. Contact: Jan Vardaman (512) 372-8887