EMBEDDEDNET Archives

April 2006

EmbeddedNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Daniel Brandler <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, Daniel Brandler <[log in to unmask]>
Date:
Thu, 20 Apr 2006 10:27:15 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (15 lines)
Dennis,

Thanks for the info. I don't think that the technology for inserting
components into PCBs is a "threat" to embedded passives. The designs
look like a very expensive constructions. Except for "inserting  known
good dies," I doubt that sequentially built PCBs with "cutouts" will be
cost competitive with conventional multilayer PCBs and embedded passive
components. Furthermore, a 1005 size limit (0402 to us) is not small
enough. They will have to do better than that.

Best regards,

Daniel Brandler
Ohmega Technologies, Inc.

ATOM RSS1 RSS2