Gary and all,
Is there is a committee for this technology? If so, how can I get
involve and be part of this committee and when/where is the next
meeting?

Thanks,

Hikmat Chammas
Engineering technology Fellow 
Honeywell
Phoenix, AZ

-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Gary Ferrari
Sent: Tuesday, January 26, 2010 6:12 AM
To: [log in to unmask]
Subject: Re: [EM] JPCA standard on embedded components, included active
silicon devices

Denny,

The IPC-2227 Embedded Design Standard committee has already spent 
considerable time reviewing this document for inclusion in our design 
standard. At our recent meeting in Phoenix, we determined what items are

appropriate, as written, and those items that need more design 
information. At this point we are seeking input for those items that we 
felt were lacking. We will be meeting at Apex on Thursday, April 8th, at

3:15pm.

Regards,

Gary Ferrari
FTG Circuits
Director, Technical Support
860-350-9300

On 1/25/2010 9:43 PM, Dennis Fritz wrote:
> All - here is the JPCA spec on embedded devices inside circuit boards.
> JPCA is submitting this document for international adoption to the
> International Electrotechnical Commission (IEC) Committee 91 for
> consideration and approval.
>
> I anticipate that there will be discussion of how the US and IPC will
> handle active silicon inside the circuit board at the upcoming Apex
> technical meetings.  Please review this, as this is a new blend -
circuit
> boards and electronic components in the same spec.
>
> Denny
>
>
> (See attached file: 3.1-090702(Shibata-Embedded)_JPCA EB01-2nd Ed.pdf)

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