Gary and all, Is there is a committee for this technology? If so, how can I get involve and be part of this committee and when/where is the next meeting? Thanks, Hikmat Chammas Engineering technology Fellow Honeywell Phoenix, AZ -----Original Message----- From: EmbeddedNet [mailto:[log in to unmask]] On Behalf Of Gary Ferrari Sent: Tuesday, January 26, 2010 6:12 AM To: [log in to unmask] Subject: Re: [EM] JPCA standard on embedded components, included active silicon devices Denny, The IPC-2227 Embedded Design Standard committee has already spent considerable time reviewing this document for inclusion in our design standard. At our recent meeting in Phoenix, we determined what items are appropriate, as written, and those items that need more design information. At this point we are seeking input for those items that we felt were lacking. We will be meeting at Apex on Thursday, April 8th, at 3:15pm. Regards, Gary Ferrari FTG Circuits Director, Technical Support 860-350-9300 On 1/25/2010 9:43 PM, Dennis Fritz wrote: > All - here is the JPCA spec on embedded devices inside circuit boards. > JPCA is submitting this document for international adoption to the > International Electrotechnical Commission (IEC) Committee 91 for > consideration and approval. > > I anticipate that there will be discussion of how the US and IPC will > handle active silicon inside the circuit board at the upcoming Apex > technical meetings. Please review this, as this is a new blend - circuit > boards and electronic components in the same spec. > > Denny > > > (See attached file: 3.1-090702(Shibata-Embedded)_JPCA EB01-2nd Ed.pdf) ______________________________________________________________________ This email has been scanned by the MessageLabs Email Security System. For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________