Colleagues:
As there has been no reportable progress with the Gage R&R testing for
the Test Method 2.5.7.2, "Dielectric Withstanding Voltage - Thin
Dielectric Layers for Printed Circuit Boards" (also called Hi Pot
testing), the D-54 Subcommittee leadership and IPC Staff liaison have
jointly decided that this month's teleconference will not be held.
This D-54 Subcommittee teleconference would have been this Thursday,
April 13 at 3:00 - 4:00 pm CDT.
Please do not call in.
Thanks!
Tom Newton