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May 2004

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Subject:
IPC EPUG Teleconference
From:
Susan Filz <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, Susan Filz <[log in to unmask]>
Date:
Thu, 20 May 2004 15:05:00 -0500
Content-Type:
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Dear Colleagues: 

The IPC Embedded Passives Users Group will be having a teleconference
Thursday, June 3 at 1:00 pm Central time. The call in number is
620-584-8200. The PIN is 1546. 

 

Please join us for "Advantages of Thin Laminate Buried Capacitance
Constructions for High Speed PCB Applications," presented by Nick Biunno
and George Dudnikov of Sanmina SCI. 

 

Please let me know if you have any questions, I can be reached at
[log in to unmask] 

 

Thanks,

Susan Filz

Manager, IPC Industry Programs

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