Dear Colleagues: The IPC Embedded Passives Users Group will be having a teleconference Thursday, June 3 at 1:00 pm Central time. The call in number is 620-584-8200. The PIN is 1546. Please join us for "Advantages of Thin Laminate Buried Capacitance Constructions for High Speed PCB Applications," presented by Nick Biunno and George Dudnikov of Sanmina SCI. Please let me know if you have any questions, I can be reached at [log in to unmask] Thanks, Susan Filz Manager, IPC Industry Programs