I cannot tell you all how pleasantly surprised I am that this single posting has generated so much interest. AND, from so many experts from around the world.  

Susan, we may want to talk about updating this topic during IPC Expo.  Maybe it is not a strong US topic, but it seems to be very interesting around the world. In my absence at the Tuesday Suppliers Council meeting, please bring this up, and I will catch up Tuesday after 5 PM.  

Denny



-----Original Message-----
From: Michael Weinhold <[log in to unmask]>
To: EmbeddedNet <[log in to unmask]>
Sent: Wed, Feb 8, 2012 5:16 am
Subject: [EM] Fwd: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom?


Begin forwarded message:
> From: Michael Weinhold <[log in to unmask]>
 Date: February 8, 2012 10:25:16 GMT+01:00
 To: D-50 Embedded Devices Committee Forum <[log in to unmask]>, "Viklund, 
er" <[log in to unmask]>
 Cc: Michael Weinhold <[log in to unmask]>
 Subject: Re: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom?
 
 Dear Experts,
 
 During the EIPC Winter Conference in Prague, on Feb. 2 and 3, 2012, embedding 
as a hot topic.
 The automotive industry sees an absolute need to meet the goals for improved 
eliability, miniaturization and cost reduction.
 Standard active and passive devices are embedded. Europe and Japan are very 
uch in the driver seat for the embedding technology.
 Hofmann Leiterplatten in Germany filed a patent in 1996 and it was granted in 
004. See details in the paper published at the Electronic Circuit World 
onvention in Taiwan in Nov. 2011
 AT&S has purchased the patent end of 2011.  This is an important step for a 
roven approach into the embedding technology using PCB (organic) material.
 During the conference the keynote presenter explained the leading role Europe 
n making the embedding technology more accepted at the leading automotive 
esign center around the world.
 The most comprehensive information on embedding and testing are coming from 
apan. 
 Standard on Device Embedded Substrate
 Terminology Reliability Test/Design Guide
 -Edition 4.0-
 JPCA-EB01 (2011)
 
 The version in the second edition are supplied as a IEC standard Proposal for 
mbedding devices in PCB.  A copy of this can be ordered through the EIPC 
westenbergeipc.org.  More details you will find on the Web: 
ttp://campaign.r20.constantcontact.com/render?llr=yyotzndab&v=001dTY-NYldfV0MeV9dd7Dzv5NBjZJP8_mQbImLLAQXe-CLp2c1qFJ3pREwnLTBX7bMzl-wSnEsixsYc7JkIJ8fFFMc464jeq65N5Mvkb7Qn4g%3D
 
 See you in San Diego at APEX 2012
 Best regards
 
 Michael Weinhold
 
 
 
 On Feb 8, 2012, at 9:50 , Viklund, Per wrote:
 
> Hi Lionel,
> When you say the boom is still there, are you talking about enbedded 
hin/thick-film resistors or embedded decoupling capacitance?
> ...or both?
> 
> /per viklund
> 
> 
> 
> 8 feb 2012 kl. 03:15 skrev "Lionel Fullwood" <[log in to unmask]>:
> 
>> HI ALl:
>> 
>> This is from Lionel at WKK in Hong Kong.
>> 
>> THE BOOM IS STILL THERE!   It is just that those involved are not openly 
>> discussing it, as there is a definite market advantage for smart users!
>> 
>> Lionel.
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 Michael Weinhold
 EIPC Technical Director
 European Institute of Printed Circuits
 Bourgognestraat 16
 P.O.Box 2060
 NL-6201CD Maastricht
 Office Phone: +31 43 3440872;  Direct Phone: +49 2223 708639
 Fax: +31 43 3440873;  Direct Fax: +49 2223 700896
 
 E-Mail: [log in to unmask]
 Web: www.eipc.org
 
 
 
 
 
 
 
 
Michael Weinhold
IPC Technical Director
uropean Institute of Printed Circuits
ourgognestraat 16
.O.Box 2060
L-6201CD Maastricht
ffice Phone: +31 43 3440872;  Direct Phone: +49 2223 708639
ax: +31 43 3440873;  Direct Fax: +49 2223 700896
E-Mail: [log in to unmask]
eb: www.eipc.org




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