I cannot tell you all how pleasantly surprised I am that this single posting has generated so much interest. AND, from so many experts from around the world. Susan, we may want to talk about updating this topic during IPC Expo. Maybe it is not a strong US topic, but it seems to be very interesting around the world. In my absence at the Tuesday Suppliers Council meeting, please bring this up, and I will catch up Tuesday after 5 PM. Denny -----Original Message----- From: Michael Weinhold <[log in to unmask]> To: EmbeddedNet <[log in to unmask]> Sent: Wed, Feb 8, 2012 5:16 am Subject: [EM] Fwd: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom? Begin forwarded message: > From: Michael Weinhold <[log in to unmask]> Date: February 8, 2012 10:25:16 GMT+01:00 To: D-50 Embedded Devices Committee Forum <[log in to unmask]>, "Viklund, er" <[log in to unmask]> Cc: Michael Weinhold <[log in to unmask]> Subject: Re: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom? Dear Experts, During the EIPC Winter Conference in Prague, on Feb. 2 and 3, 2012, embedding as a hot topic. The automotive industry sees an absolute need to meet the goals for improved eliability, miniaturization and cost reduction. Standard active and passive devices are embedded. Europe and Japan are very uch in the driver seat for the embedding technology. Hofmann Leiterplatten in Germany filed a patent in 1996 and it was granted in 004. See details in the paper published at the Electronic Circuit World onvention in Taiwan in Nov. 2011 AT&S has purchased the patent end of 2011. This is an important step for a roven approach into the embedding technology using PCB (organic) material. During the conference the keynote presenter explained the leading role Europe n making the embedding technology more accepted at the leading automotive esign center around the world. The most comprehensive information on embedding and testing are coming from apan. Standard on Device Embedded Substrate Terminology Reliability Test/Design Guide -Edition 4.0- JPCA-EB01 (2011) The version in the second edition are supplied as a IEC standard Proposal for mbedding devices in PCB. A copy of this can be ordered through the EIPC westenbergeipc.org. More details you will find on the Web: ttp://campaign.r20.constantcontact.com/render?llr=yyotzndab&v=001dTY-NYldfV0MeV9dd7Dzv5NBjZJP8_mQbImLLAQXe-CLp2c1qFJ3pREwnLTBX7bMzl-wSnEsixsYc7JkIJ8fFFMc464jeq65N5Mvkb7Qn4g%3D See you in San Diego at APEX 2012 Best regards Michael Weinhold On Feb 8, 2012, at 9:50 , Viklund, Per wrote: > Hi Lionel, > When you say the boom is still there, are you talking about enbedded hin/thick-film resistors or embedded decoupling capacitance? > ...or both? > > /per viklund > > > > 8 feb 2012 kl. 03:15 skrev "Lionel Fullwood" <[log in to unmask]>: > >> HI ALl: >> >> This is from Lionel at WKK in Hong Kong. >> >> THE BOOM IS STILL THERE! It is just that those involved are not openly >> discussing it, as there is a definite market advantage for smart users! >> >> Lionel. >> ** Email Disclaimer ** >> This message and any attachments are confidential and are intended only for he use of the addressee. If you are not the intended recipient, you should not isseminate, distribute or copy this communication. If you have received this ommunication in error, please notify us immediately by return email and delete he original message. We use virus scanning software but exclude all liability or viruses or similar in any attachment. Thank you. >> >> >> ______________________________________________________________________ >> This email has been scanned by the Symantec Email Security.cloud service. >> For more information please contact helpdesk at x2960 or [log in to unmask] >> ______________________________________________________________________ > > ______________________________________________________________________ > This email has been scanned by the Symantec Email Security.cloud service. > For more information please contact helpdesk at x2960 or [log in to unmask] > ______________________________________________________________________ > Michael Weinhold EIPC Technical Director European Institute of Printed Circuits Bourgognestraat 16 P.O.Box 2060 NL-6201CD Maastricht Office Phone: +31 43 3440872; Direct Phone: +49 2223 708639 Fax: +31 43 3440873; Direct Fax: +49 2223 700896 E-Mail: [log in to unmask] Web: www.eipc.org Michael Weinhold IPC Technical Director uropean Institute of Printed Circuits ourgognestraat 16 .O.Box 2060 L-6201CD Maastricht ffice Phone: +31 43 3440872; Direct Phone: +49 2223 708639 ax: +31 43 3440873; Direct Fax: +49 2223 700896 E-Mail: [log in to unmask] eb: www.eipc.org ______________________________________________________________________ his email has been scanned by the Symantec Email Security.cloud service. or more information please contact helpdesk at x2960 or [log in to unmask] _____________________________________________________________________ ______________________________________________________________________ This email has been scanned by the Symantec Email Security.cloud service. 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