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August 2001

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Subject:	BGA Assembly
From:	John Morin <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Thu, 2 Aug 2001 09:08:53 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (22 lines)

        Just breaking into BGA's on our boards. The question of pin escapes and
assembly reliability has come up. Is it important to use a single style
of pin escape strategy in order to have a uniform solder joint. It seems
to me that if some "balls" had pin escapes and others did not, there
could be some differences in the joint due to the heat sinking effect of
the via.

        Should the pin escape be a "dog bone" style, oval or .....?

                TIA
                John

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