Just breaking into BGA's on our boards. The question of pin escapes and assembly reliability has come up. Is it important to use a single style of pin escape strategy in order to have a uniform solder joint. It seems to me that if some "balls" had pin escapes and others did not, there could be some differences in the joint due to the heat sinking effect of the via. Should the pin escape be a "dog bone" style, oval or .....? TIA John --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------