Bob,

Is there going to be a paper written up on this talk? It seems all the
good stuff is on the left or right coast. I'm particularly interested
because TTM is where I get my boards fabbed and they do a great job.

Regards,

Ron Scott C.I.D.
Texas Instruments
Tel:  214.480.4715
Cell: 972.816.7978
[log in to unmask]

 
 

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Bob
McCreight
Sent: Wednesday, October 27, 2004 16:56
To: [log in to unmask]
Subject: [DC] Meeting Announcement: Silicon Valley Chapter - IPC
Designers Council (Nov. 9)

The Silicon Valley Chapter of the IPC Designers Council Next meeting
will take place on Tuesday November 9, 2004

Location:
Mentor Graphics
San Jose (1001 Ridder Park Drive).
Time: 11:30AM - 1:30PM
$1 for members; $5 for non-members
RSVP required > send to [log in to unmask]

Topic: "Via In Pad - A New Approach"
by Donald A. Carron

Items covered
1 - Reasons for implementing Pad on via
2 - The new approach to successfully implement this at the fabrication
3 - The old side effects and new process such as blow hole, via cracking
etc
4 - Are the any issues during assembly, or design considerations?

About the Speaker:
Donald A. Carron
Director of Technology
TTM Technologies, Inc.
Santa Ana Division

Entered the world of PWB manufacturing in January 1983, and had the
opportunity to work in all aspects of production from front-end planning
through final inspection.
Became a Director of Quality Assurance in the mid eighties, and
developed an outline for quality engineering functions in both
mechanical and wet processing areas of manufacturing. Worked in process
development in the mid nineties through the present, with an emphasis on
emerging technologies to facilitate high-density routing in modern
printed circuit design. Worked with the first company (in Japan) to
develop fully copper-plated microvia geometries, which was the
forerunner to current plating technologies utilized in advanced
facilities today (such as TTM Santa Ana, who employs the most advanced
microvia plating process currently available).
I am currently Director of Technology at TTM Technologies' Santa Ana
Division, and am responsible for both product development and process
engineering staff.

University of Vermont-Mathematics
National University-Business
ASQ CQE Training
Member of IPC Designer's Council-San Diego Chapter

~  ~  ~  ~  ~  ~  ~  ~  ~  ~

Please RSVP to [log in to unmask]
http://dcchapters.ipc.org/svc/





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