Looks like it to me, unless they want to pay extra for the ENIG just to
have it disappear when the solder plating is applied. I would call them
:)
--
George Patrick
Tektronix, Inc.
Central Engineering, EDS Applications Support
P.O. Box 500, M/S 39-512
Beaverton, OR 97077-0001
* 503-627-5272 (voice) * 503-627-5587 (fax)
http://www.tektronix.com http://www.pcb-designer.com
"Off-Grid and Proud of it!"
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
James Jackson
Sent: Thursday, February 08, 2007 11:53
To: [log in to unmask]
Subject: [DC] Contradictory Fab Notes?
Okay folks,
We have a client that we have contracted to fabricate a PCB for.
They finally produced a Fab Drawing, and in the Notes, they have the
following...
3.2 Board Material to comply with IPC 4101/21,
FR4 Material. Copper Clad both sides, 1Oz
Copper, 0.062 Thk, ENIG Plating finish.
...
3.9 Electro Solder Plate entire copper surfaces,
.0003 minimum thickness and reflow solder
(Infrared Fusing Preferred).
....
Now... to my way of thinking, they have specified the PCB finish twice.
In 3.2, they are wanting a gold finish (Electroless Nickel Immersion
Gold).
In 3.9, they are wanting a solder-plated finish.
Or, am I mis-reading this?
(I have left out the other notes 3.1, and 3.3 - 3.8, as they do not
apply to
this.)
Could someone more knowledgeable set me straight?
Regards,
James Jackson
Oztronics
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