I would like to know if there are folks out there who are regularly
using blind/buried vias or via-in-pad technology.
* What is your experience (sucessful or not successful)?
* What is the minimum hole size you are using?
* What are the cost increase or savings at the fab level and
also the assembly/rework level?
I want to get real-world feedback from those who have experience with
this. Thanks in advance for any info you can provide.
********************
Alexis Meehan
PCB CAD Mgr.
408-328-4595
[log in to unmask]
570 Maude Court
Sunnyvale, CA 94085
http://www.luxn.com
LuxN - The Optical Renaissance has begun!(tm)
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