I would like to know if there are folks out there who are regularly using blind/buried vias or via-in-pad technology. * What is your experience (sucessful or not successful)? * What is the minimum hole size you are using? * What are the cost increase or savings at the fab level and also the assembly/rework level? I want to get real-world feedback from those who have experience with this. Thanks in advance for any info you can provide. ******************** Alexis Meehan PCB CAD Mgr. 408-328-4595 [log in to unmask] 570 Maude Court Sunnyvale, CA 94085 http://www.luxn.com LuxN - The Optical Renaissance has begun!(tm) --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------