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January 2003

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Subject:	Re: Fr-4, Finish specs for wire bonding
From:	Louis Dallara <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Wed, 15 Jan 2003 14:11:31 -0500
Content-Type:	multipart/alternative
Parts/Attachments:	text/plain (3103 bytes) , text/html (6 kB)

http://www.ksbonder.com/

Check out ...

-----Original Message-----
From: Mark Barlow [mailto:[log in to unmask]]
Sent: Wednesday, January 15, 2003 2:03 PM
To: [log in to unmask]
Subject: [DC] Fr-4, Finish specs for wire bonding

Hello all,

I'm looking for some recommendations or resources concerning aluminum wedge wire bonding.
Primarily FR-4 board finish requirements. There seems to be a lot of info out there on
Bonding procedures and equipment but little on Board finish requirements.

These boards are about 98% SMT components with only a couple of wire bonds per board.

We currently spec SMOBC Electroless Nickel Immersion Gold
3-10 microinches of gold with a minimum of 100 microinches Nickel.

We seem to have pretty good results with this spec but at times encounter
pads which require multiple attempts to achieve a good bond.
It very well could be our wire bonding process or just a bad batch of boards.

I was wondering from a board finish perspective whether increasing the Nickel or gold requirements
would produce better results?

Mark Barlow
Electronic Designer
[log in to unmask]

Apache Technologies, Inc.
8261 S.R. 235
Dayton, Ohio 45424
Ph: (937) 482-0200
Fx: (937) 482-0030
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