DESIGNERCOUNCIL Archives

1996

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0v3O16-0000SBC; Wed, 18 Sep 96 09:54 CDT
Old-Return-Path:
<[log in to unmask]>
Date:
Wed, 18 Sep 1996 11:02:48 -0400
Precedence:
list
X-Loop:
[log in to unmask]
Message-ID:
<[log in to unmask]>
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/2029
TO:
[log in to unmask]
Return-Path:
<DesignerCouncil-request>
From [log in to unmask] Wed Sep 18 10:
32:44 1996
Resent-Message-ID:
<"r3DwN1.0.ESJ.Kq0Go"@ipc>
Subject:
Re: Design (fwd)
From:
[log in to unmask]
Resent-From:
[log in to unmask]
Resent-Sender:
DesignerCouncil-request [log in to unmask]
Parts/Attachments:
text/plain (21 lines) 
Tom;

Assemblers are still recommending the use of thermal connections on vias that
are used to connect to a plane. The reason is that removal of surface mount
components becomes very difficult. Hot air systems are used and the heat
transfer to the plane is too great.

Regards,

Gary Ferrari
IPC Staff 

****************************************************************************
* The mail list is provided as a service by IPC using SmartList v3.05      *
**************************************************************************** 
* To unsubscribe from this list at any time, send a message to:            *
* [log in to unmask] with <subject: unsubscribe> and no text. *
****************************************************************************

ATOM RSS1 RSS2