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Reply To: | DesignerCouncil E-Mail Forum. |
Date: | Thu, 30 Mar 2000 09:18:52 -0500 |
Content-Type: | multipart/alternative |
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I would like to take an informal survey of what folks are commonly
specifying for standard signal via padstacks for 0.062" thick, 1 oz copper,
2-4 layer boards.
I am in the process of revamping our decal libraries to comply with IPC
Level B producibility (as much as realistically possible) and am troubled by
the 0.013" +/-0.003" Dia. finished hole / 0.025" Dia. pad that was specified
by my predecessors. This doesn't even meet Level C and I am concerned about
the possibility of breakout. However, to the best of my knowledge, breakout
with these vias has not been a problem in the past.
Also, since this via is currently being used, I do not want to increase the
pad size, but would rather decrease the finished hole size. What is the
minimum finished hole size that won't drive up the cost with your particular
fabricator?
Your comments on this would be appreciated.
- Tom
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Thomas A. Frayda, C.I.D.
PCB Designer
Detection Systems, Inc.
130 Perinton Parkway
Fairport, NY 14450-9199
www.detectionsys.com <http://www.detectionsys.com/>
www.dsworld.com <http://www.dsworld.com/>
TEL: 716-223-4060 x4365
FAX: 716-421-4263
E-mail: [log in to unmask] <mailto:[log in to unmask]>
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