The rate of fall off was evidently high enough or troublesome enough for
our production people to request this type of test. I am hoping one of the
soldermask vendors out there listening in cyberland will respond to my
original question.

----------
> From: Karl J. Bates <[log in to unmask]>
> To: [log in to unmask]
> Subject: Re: [DC] Gen: Soldermask Adhesion
> Date: Thursday, December 04, 1997 7:42 AM
>
> I don't understand why you would want to test adhesion, it
> seems as though you are trying  to accomplish a unreasonable
> task.   From what I understand, the glue dots are just a
> temporary adhesion until the wave solders them and attaches
> them completely.  Maybe a more complete explanation is in
> order, detailing why you are trying to pull them off in the
> first place.  (or are your parts always falling off?)
>
> Karl

##############################################################
IPC Designers Council Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE DESIGNERCOUNCIL <your full name>
To unsubscribe:   SIGNOFF DESIGNERCOUNCIL
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################